LGA
HoldTechniques
Land Grid Array packaging where the socket carries the fragile contacts instead of the processor pins.
Why it's here
Placed in Hold: 1 article(s) of evidence from 1 source(s), led by research-stage coverage, with 0 in the last 30 days. Confidence 24%. Low accumulated evidence, so it defaults conservatively pending more signal.
Evidence (1)
- 2Hacker News·8/23/2026researchAn Athlon CPU Chip Cracks During Heatsink Removal
The article describes an AMD Athlon XP processor that remained functional until a chunk of exposed silicon broke off during heatsink removal. It uses the incident to illustrate the fragility of flip-chip PGA packaging used on early Athlon and Pentium III-era CPUs, compared with later lidded or LGA designs.